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词汇
flip chip
释义
flip chip
覆晶技术
是指将晶片翻转後,以面朝下方式,透过金属导体与基板进行接合的封装技术。它可以将电晶体直接覆盖在晶粒上,大幅缩小晶粒尺寸,运用这种封装技术的产品,未来将可有效运用在笔记型电脑主机板或其它可携式产品。
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更新时间:2026/10/13 22:01:26